Most computer components fight with severe fever. The higher the power or the higher the speed, the greater the heat you can avoid. There are several parts of the project. However, many manufacturers keep the heat as low as possible and develop appropriate technologies to provide optimum working conditions. There are different ways, including the expansion of the cooling system by introducing cooling water technology.
This is true for processors, which are one of the main components of PC. Processors that handle many data processing and overall system performance are also as effective as preventing heat. This affects stability. Is this a? There is a strong interest in the structure of the recently released 9-nucleus processor heat exchanger. I have a place to look at this briefly.
How to turn off the heat and protect the heater
Previously, processors worked to influence the outside of the chip (nucleus). Because it was able to mitigate the fever clearly and intuitively. When a processor is installed frequently, the cooling unit is placed on top of the processor and the heat-conducting material is used. The heat transfer capacity varies widely due to the operation of the heat conductor and the cooling device. Many people have chosen a great cooling system, trying to achieve high performance (accelerator).
However, this has led to side effects. This is due to some nuclei being damaged during installation. This is a burden for increasing and collecting costs. So to protect the core and to maintain the maximum performance of the heat conductor, I used the (?) Heatspreader cap. Intel is referred to as the Integrated Thermal Transmitters (IHS).
The use of the heat pump has the advantage of a significant reduction in the processor build-up, but the other problem, in particular, is the thermal conductivity.
Cooling performance can be maximized even if the core and the cooling system are in direct contact with each other. However, the heat exchanger does not make good contact with the nucleus, so productivity fills space between them. If the gap is wide and the performance of the filling thermal conductive material is poor, the thermal treatment is not performed correctly.
The method of protecting the nuclei to provide cooling operation using the heat sink. Thermal interface material (STIM) for this purpose has been developed. It is often regarded as a "contact matrix".
Connects the STIM core and heat exchanger
The architecture of the processor looks simple, but it is much more complicated when viewed in detail. The final processor we use is the nucleus placed on the substrate, and the rings for the current routing are created between them. It's like when it's kernel. However, a heat exchanger with the current heat exchanger (heat exchanger) – allows the sealing of the core while fixing the edge of the board.
As it was said above, it is important to close the heat sink core when filling it. Previously, sand bridges used the method of combining them. It utilizes rare material called indium, which joins the silicon core and thermal transmitter copper. Then, it was replaced by the TDI (Thermal Interface Material) method, which uses a thermal bond within the contact method instead of the join method, and then the STIM method was adopted after arriving at the 9th generation core processor.
The gain from using the STIM method is the heat conductivity. The Induum has a thermal conductivity of approximately 80 W / mK. Copper is lower than 400 m / m, but it has a high value compared to the thermal conductivity. In addition, the Indian has a high smoothness, so it is expanded by heat, but does not greatly damage the processor. The benefits of heating and endurance are important.
Lastly, STIM & # 39;
The problem is price and production difficulties. First let's look at the price. According to the Korean Mineral Resources Corporation, the Indian price for November 2018 is $ 237.5 / kg (Korean Won 266,000 W). Six months ago, this figure dropped to nearly $ 340 (about 381,000 volts) and increased to about $ 800 in 2014. Previously, after 2015, it remained at around $ 250- $ 300, with some exceptions.
Thermal absorbers are made of copper, but it uses a few metals for a long time. Nickel, gold, silver and palladium. These metals are difficult and highly appreciated. Rare metals are not easy to answer because of high liquidity fluctuations. It just means that there are more complex relationships than costs.
There are also difficulties in production. The indium attracts the core and the heat exchanger during the binding process, which can cause deformation. In this process, an explosion may occur between indium compounds, which may result in deterioration of the heat conductivity. High heat resistance can damage the core for a long time.
The cracks in the Indian junction are often affected by the size of the smaller nucleus. Thus, processes in the main nuclei and the dimensions of smaller nuclei can not be used by conventional processors, depending on the relative smaller advantages of the method of binding.
Why did the 9th generation kernel processor use the site? The number of wells has increased by two to three times from the baseline database, and the performance of the main graphics has improved, resulting in a larger area. This has led to a reduction in the difficulty of using the communication method. It also has high-speed (3.6 – 3.7 GHz) function, and it has the ability to efficiently solve the heat that supports the accelerator. As a result, the market's commitment to productivity, technological completeness, and so on. Integrated with the 9th generation core processor.
Donga.com IT Specialist Kang Hyung-suk correspondent [email protected]
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